JVD: The Silicon Valley Center of Excellence for Contract Semiconductor Testing

JVD began testing Analog Mixed-signal ICs in 1982 as an adjunct to its Design Services business. Today, in addition to its iASIC customers, JVD tests wafers and components for many of Silicon Valley’s premiere chip companies as well as numerous small and medium sized fabless IC companies. The microelectronics testing facility in San Jose maintains seventeen probe stations, suitable for all your testing needs.

Wafer Probe Capabilities

JVD is your one stop shop for all your probe card design, fabrication, verification, wafer test and production needs.

  • 3″ to 8″ capability standard (inquire for larger wafer diameters)
  • Al, Au pads
  • Bumped probe: Pb, Pb free
  • Extended temp (Hot & Cold) Probe
  • Extensive data analysis capability including die level device characterization
  • Fine pitch, High pin count
  • High volume production probe
  • Multi site testing
  • Probe card design, fabrication and verification
  • RF probe capability
  • Vacuum wafer storage
  • Wafer back grind to 4 mils

Experience

  • Analog and mixed-signal ASICs
  • Very low power RFID chip sets
  • MEMS devices and sensors
  • Hearing aid amplifiers and components
  • Automotive sensor protection devices
  • Wireless communication chip sets
  • Consumer electronic devices
  • High voltage thyristors
  • Power supplies
  • Photo detectors
  • Analog switches
  • LED display drivers
  • Voltage references
  • Low capacitance ESD protection diodes<2pF
  • Operational Amplifiers
  • PIN diodes
  • High voltage transistors
  • Tuning capacitors
  • High power transistors
  • Other discrete components

From Wafer Characterization and Qualification to Production Test

JVD’s highly-skilled staff are well versed in helping you identify the best test methodology for your device. Test specifications are developed jointly, taking into consideration variables such as test times and wafer throughput, DFT, environmental conditions and more. Probe cards and test load boards can sometimes be as complicated as the IC they are testing so JVD engages that aspect of the project at the initiation of the device design.

In addition to production wafer probe and final test, JVD will also conduct all your characterization and qualification testing, providing you with a complete package of detailed and summary data that you can make available to your critical customers. JVD takes care of the complete range of development and semiconductor testing processes: from wafers, to qualification testing, through to the final functional test of packaged devices.

Too Many Die to Count

JVD’s successful track record has made it a stellar success in the testing world. A recent program with SunPower Corp resulted in probing over 140,000,000 optical die without a single error. JVD’s test strategies offer the lowest cost/highest performance results. Whether your application is for a few hundred or a few million devices, JVD stands ready to support your requirements at the die or packaged level.

Tell Us Your Needs

The best time to involve JVD test services is when you begin to conceive your chip design. Our engineering resources can assist you with defining the optimum device architecture that lends itself perfectly to the testing of your device. Early collaboration has proven to enhance the total quality of the end product while improving that all important metric; time-to-money. Getting your design safely into production is our first priority.